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氮化镓器件技术应用现状及趋势

作者:冯园园 张洁雪 出版日期:2019年06月 报告页数:12 页 报告大小: 报告字数:9181 字 所属丛书:工业和信息化蓝皮书 所属图书:集成电路产业发展报告(2018~2019) 浏览人数: 下载人数:

文章摘要:氮化镓(GaN)材料是宽禁带材料的一种,适于制造高频大功率、耐高温、抗辐射半导体微电子器件等,在军民两用领域均有巨大的应用前景。经过自21世纪以来美国等国家的持续推动,GaN器件和工艺技术快速成熟,产品大量上市,并已用于多个在研武器中。GaN器件已在性能、尺寸、可靠性和成本间取得平衡,并开始逐步替代市场上成熟的砷化镓(GaAs)和硅横向扩散金属氧化物半导体(LDMOS)器件,市场前景极其广阔。

Abstract:Gallium nitride(GaN)material is a kind of wide bandgap material,suitable for manufacturing high frequency,high power,high temperature resistant,radiation resistant semiconductor microelectronic devices,etc. It has great application prospects in both military and civilian fields. After continuous promotion in the United States and other countries since the 21st century,GaN devices and process technologies have matured rapidly,... 展开

Abstract:Gallium nitride(GaN)material is a kind of wide bandgap material,suitable for manufacturing high frequency,high power,high temperature resistant,radiation resistant semiconductor microelectronic devices,etc. It has great application prospects in both military and civilian fields. After continuous promotion in the United States and other countries since the 21st century,GaN devices and process technologies have matured rapidly,and a large number of products have been launched,and have been used in many weapons under research. GaN devices have balanced performance,energy efficiency,size,reliability,and cost,and have replaced the market for mature GaAs and silicon laterally diffused metal oxide semiconductors(LDMOS).

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作者简介

冯园园:冯园园,国家工业信息安全发展研究中心(工业和信息化部电子第一研究所)高级工程师,研究方向为集成电路、半导体、军用电子元器件等。

张洁雪:张洁雪,国家工业信息安全发展研究中心(工业和信息化部电子第一研究所)工程师,研究方向为人工智能、信息服务等。