三维硅通孔堆叠封装技术发展现状及趋势

Abstract:As the Moore’s Law is about to fail，the functional density of the chip has reached the limit of two-dimensional packaging technology. Three-dimensional stacked packaging has become one of the important ways to maintain the rapid development of the semiconductor industry. Three-dimensional packaging can further enhance the transistor density，reduce size，shorten the connection，reduce power consumption，improve high-frequency performance，etc. The three-dimensional stacking packaging of connecting technology is the ultimate development direction of stacking packaging. The first device to realize three-dimensional stacked applications is memory. In the future，high，middle and low-end applications will be developed synchronously. The number of vertical integrators，packaging and testing factories，manufacturing factories and other enterprises will be further increased，and the industrial system will be gradually improved.

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