美国下一代军用半导体技术发展举措研究

Abstract:As Moore’s Law is come to an end due to the technical and economic constraints，a large number of new technologies have emerged in semiconductor industry in three major areas：new devices，high density packaging and new computing paradigm. Faced with the turning point of the development of the semiconductor industry，the US Department of Defense jointly initiated a semiconductor development revolution that no longer relies on traditional “equal-scale shrinkage” in industry and academia to ensure that the US continues to lead in basic electronics. The Defense Advanced Research Projects Agency（DARPA） took advantage of organizational innovation，launched three major projects from the end of 2016 to August 2017：Joint University Microelectronics Project （JUMP），Electronics Resurgence Initiative（ERI） and Common Heterogenous Integration and Intellectual Property Reuse Strategies Program（CHIPS），pushing forward the next generation of semiconductor technology through JUMP and ERP projects，bringing about a revolutionary change in the entire electronic component development and production chain through the CHIPS project，and strive to open a new era of military semiconductor technology development.

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